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For: Antonetti P, Flitris Y, Flamant G, Hellio H, Gauthier D, Granier B. Degradation products of the process of thermal recovery of copper from lamina scraps in lab-scale fluidized bed reactor. J Hazard Mater 2004;108:199-206. [PMID: 15120873 DOI: 10.1016/j.jhazmat.2003.12.013] [Citation(s) in RCA: 5] [Impact Index Per Article: 0.2] [Reference Citation Analysis] [What about the content of this article? (0)] [Track Full Text] [Subscribe] [Scholar Register] [Received: 04/27/2003] [Revised: 10/27/2003] [Accepted: 12/22/2003] [Indexed: 05/24/2023]
Number Cited by Other Article(s)
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Eisma JH, Dulle JE, Fort PE. Current knowledge on diabetic retinopathy from human donor tissues. World J Diabetes 2015;6:312-320. [PMID: 25789112 PMCID: PMC4360424 DOI: 10.4239/wjd.v6.i2.312] [Citation(s) in RCA: 33] [Impact Index Per Article: 3.3] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Download PDF] [Journal Information] [Submit a Manuscript] [Subscribe] [Scholar Register] [Received: 09/17/2014] [Revised: 12/23/2014] [Accepted: 12/31/2014] [Indexed: 02/05/2023]  Open
2
Selective dissolution of copper from copper-chromium spent catalyst by baking–leaching process. J IND ENG CHEM 2015. [DOI: 10.1016/j.jiec.2014.03.026] [Citation(s) in RCA: 11] [Impact Index Per Article: 1.1] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/21/2022]
3
Havlik T, Orac D, Petranikova M, Miskufova A. Hydrometallurgical treatment of used printed circuit boards after thermal treatment. WASTE MANAGEMENT (NEW YORK, N.Y.) 2011;31:1542-1546. [PMID: 21419617 DOI: 10.1016/j.wasman.2011.02.012] [Citation(s) in RCA: 5] [Impact Index Per Article: 0.4] [Reference Citation Analysis] [Abstract] [MESH Headings] [Track Full Text] [Subscribe] [Scholar Register] [Received: 03/01/2010] [Revised: 02/02/2011] [Accepted: 02/17/2011] [Indexed: 05/30/2023]
4
Havlik T, Orac D, Petranikova M, Miskufova A, Kukurugya F, Takacova Z. Leaching of copper and tin from used printed circuit boards after thermal treatment. JOURNAL OF HAZARDOUS MATERIALS 2010;183:866-873. [PMID: 20800354 DOI: 10.1016/j.jhazmat.2010.07.107] [Citation(s) in RCA: 29] [Impact Index Per Article: 1.9] [Reference Citation Analysis] [Abstract] [MESH Headings] [Track Full Text] [Subscribe] [Scholar Register] [Received: 04/21/2010] [Revised: 07/12/2010] [Accepted: 07/27/2010] [Indexed: 05/29/2023]
5
Guo Q, Yue X, Wang M, Liu Y. Pyrolysis of scrap printed circuit board plastic particles in a fluidized bed. POWDER TECHNOL 2010. [DOI: 10.1016/j.powtec.2009.12.011] [Citation(s) in RCA: 58] [Impact Index Per Article: 3.9] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 10/20/2022]
6
Scharnhorst W, Ludwig C, Wochele J, Jolliet O. Heavy metal partitioning from electronic scrap during thermal End-of-Life treatment. THE SCIENCE OF THE TOTAL ENVIRONMENT 2007;373:576-84. [PMID: 17204307 DOI: 10.1016/j.scitotenv.2006.11.023] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [MESH Headings] [Track Full Text] [Subscribe] [Scholar Register] [Received: 05/24/2006] [Revised: 11/01/2006] [Accepted: 11/18/2006] [Indexed: 05/13/2023]
7
Kim HK, Chung HJ, Park TG. Biodegradable polymeric microspheres with “open/closed” pores for sustained release of human growth hormone. J Control Release 2006;112:167-74. [PMID: 16542746 DOI: 10.1016/j.jconrel.2006.02.004] [Citation(s) in RCA: 186] [Impact Index Per Article: 9.8] [Reference Citation Analysis] [Abstract] [MESH Headings] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 10/11/2005] [Revised: 01/03/2006] [Accepted: 02/06/2006] [Indexed: 11/29/2022]
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