Venev P, Stefanov B, Milusheva V, Tzaneva B, Videkov V. Fabrication of Conductive Copper Patterns Using Photocatalyst-activated Electroless Deposition. 2021 12th National Conference with International Participation (ELECTRONICA) 2021. [DOI: 10.1109/electronica52725.2021.9513710][Reference Citation Analysis]
2
Wei S, Liu D, Liu C, Jiang B. Improve the tribological performance of anodic coating by plasma discharge treatment. Mater Res Express 2021;8:046404. [DOI: 10.1088/2053-1591/abdf11][Reference Citation Analysis]
3
Wei S, Dong-jie L, Can-can L, Bai-ling J. Improving insulation and thermal conductivity of anodic coating by plasma discharge treatment. AIP Advances 2021;11:025334. [DOI: 10.1063/5.0038584][Reference Citation Analysis]