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Cited by in F6Publishing
For: Yang W, Wang Y, Li Y, Gao C, Tian X, Wu N, Geng Z, Che S, Yang F, Li Y. Three-dimensional skeleton assembled by carbon nanotubes/boron nitride as filler in epoxy for thermal management materials with high thermal conductivity and electrical insulation. Composites Part B: Engineering 2021;224:109168. [DOI: 10.1016/j.compositesb.2021.109168] [Cited by in Crossref: 13] [Cited by in F6Publishing: 12] [Article Influence: 13.0] [Reference Citation Analysis]
Number Citing Articles
1 Li X, Yang L, Chen X, Jiang F. Construction of compressible dual thermally conductive boron nitride network supported by Polyurethane@Polydopamine skeleton for improved thermal management performance. Composites Part A: Applied Science and Manufacturing 2022;161:107104. [DOI: 10.1016/j.compositesa.2022.107104] [Reference Citation Analysis]
2 Yao F, Xie W, Ma C, Wang D, El-bahy ZM, Helal MH, Liu H, Du A, Guo Z, Gu H. Superb electromagnetic shielding polymer nanocomposites filled with 3-dimensional p-phenylenediamine/aniline copolymer nanofibers@copper foam hybrid nanofillers. Composites Part B: Engineering 2022;245:110236. [DOI: 10.1016/j.compositesb.2022.110236] [Reference Citation Analysis]
3 Wu M, Zhou Y, Zhang H, Liao W. 2D Boron Nitride Nanosheets for Smart Thermal Management and Advanced Dielectrics. Adv Materials Inter. [DOI: 10.1002/admi.202200610] [Reference Citation Analysis]
4 Li Y, Tang K, Jin F, Park S. Enhanced thermal stability and impact strength of phenolic formaldehyde resin using acid‐treated basalt scales. J of Applied Polymer Sci. [DOI: 10.1002/app.52827] [Reference Citation Analysis]
5 Qian Y, Tao Y, Li Y, Hao J, Xu C, Yan W, Jiang Q, Luo Y, Yang J. High performance epoxy resin with efficient electromagnetic wave absorption and heat dissipation properties for electron packaging by modification of 3D MDCF@hBN. Chemical Engineering Journal 2022;441:136033. [DOI: 10.1016/j.cej.2022.136033] [Cited by in Crossref: 3] [Cited by in F6Publishing: 1] [Article Influence: 3.0] [Reference Citation Analysis]
6 Zhang S, Chen W, Zhao Y, Ding L, Pan X, Du B, Shen H, Gong C, Yang W, Yang K, Chen X. Designing multi-aromatic ring epoxy composites to integrate high insulation and high heat resistance performances by electron-induced effect. Composites Part B: Engineering 2022;243:110107. [DOI: 10.1016/j.compositesb.2022.110107] [Reference Citation Analysis]
7 Wang Y, Zhao Z, Gu A, Wei Z, Chen W, Yan C. Enhancement of thermal conductivity of BN-Ni/epoxy resin composites through the orientation of BN-Ni fillers by magnetic field and hot-pressing. Ceramics International 2022. [DOI: 10.1016/j.ceramint.2022.07.301] [Reference Citation Analysis]
8 Cai Y, Chen S, Wang Y, Lin T, Gao M, Zhao C, Wu X, Lin C, Zhai R, Liu J. 2D-3D collaborative network based on conductive sponge and flake graphite to design high performance silicone rubber composites. J Mater Sci. [DOI: 10.1007/s10853-022-07459-3] [Reference Citation Analysis]
9 Jin L, Cao W, Wang P, Song N, Ding P. Interconnected MXene/Graphene Network Constructed by Soft Template for Multi-Performance Improvement of Polymer Composites. Nanomicro Lett 2022;14:133. [PMID: 35699778 DOI: 10.1007/s40820-022-00877-7] [Cited by in Crossref: 1] [Cited by in F6Publishing: 1] [Article Influence: 1.0] [Reference Citation Analysis]
10 Wang T, Lin Y, Li P, Jiang P, Zhang C, Xu H, Xie H, Huang X. Unidirectional thermal conduction in electrically insulating phase change composites for superior power output of thermoelectric generators. Composites Science and Technology 2022. [DOI: 10.1016/j.compscitech.2022.109500] [Reference Citation Analysis]
11 Qi W, Liu M, Wu J, Xie Q, Chen L, Yang X, Shen B, Bian X, Song W. Promoting the thermal transport via understanding the intrinsic relation between thermal conductivity and interfacial contact probability in the polymeric composites with hybrid fillers. Composites Part B: Engineering 2022;232:109613. [DOI: 10.1016/j.compositesb.2022.109613] [Cited by in Crossref: 5] [Cited by in F6Publishing: 2] [Article Influence: 5.0] [Reference Citation Analysis]
12 Hu X, Huang M, Kong N, Han F, Tan R, Huang Q. Enhancing the electrical insulation of highly thermally conductive carbon fiber powders by SiC ceramic coating for efficient thermal interface materials. Composites Part B: Engineering 2021;227:109398. [DOI: 10.1016/j.compositesb.2021.109398] [Cited by in Crossref: 4] [Cited by in F6Publishing: 4] [Article Influence: 4.0] [Reference Citation Analysis]